Plunk: SK Hynix drops 72-layer 3D NAND on enterprise SSD market

Korean flasher poised to enter enterprise SSD market

By Chris Mellor

Posted in Storage, 5th February 2018 14:37 GMT

SK Hynix, currently focused on client SSDs, is posed to enter the enterprise SSD market with 72-layer 3D NAND tech.

It has developed 512Gb flash chips with this technology, and built an enterprise-class SSD using its own controller and firmware to provide 4TB of capacity. SK Hynix is not saying whether the SSD uses TLC (3bits/cell) flash or not.

The device supports sequential read and write speeds of up to 560/515MB/sec and can perform 98,000/32,000 random read/writeIOPS respectively.

There is no word on the access protocol which is likely to be SAS or SATA as the company has said it has separately developed a PCIe SSD using the same 72-layer technology.

This, it says, will have a capacity of more than 1TB and operate with 2,700/1,100MB/sec of sequential read/write bandwidth and 230,000/35,000 random read/write IOPS respectively.

SK Hynix is sampling the PCIe product to server and data centre clients in the USA.

It already lists two enterprise SSDs on its website: the SE3010, a SATA MLC (2bits/cell) SSD maxing out at 1.9TB and developed in 2015, and the PE3011, a PCI MLC SSD, about which it provides no information.

These look set to be replaced by the forthcoming products.

However, the new PCIe SSD numbers are not that high compared to competing devices from the mainstream enterprise SSD shippers. We would also expect a significantly higher capacity than the 1TB+ bar set by the company.

A stronger entry into enterprise SSD shipping by SK Hynix will increase competition with Intel, Micron, Samsung, Toshiba and WDC, and tend to lower pricing. Expect it to announce product later this year. ®

Sign up to our NewsletterGet IT in your inbox daily

5 Comments

More from The Register

Toshiba: The memory saga is nearly behind us! Apple: Not so fast

Cupertino dithers over part in purchase, WDC rubs its hands

No, Samsung, you really do owe Apple $120m for patent infringement

US Supreme Court sends another appeal packing

Swiss cheesed off after Apple store iPhone does Samsung Galaxy Note 7 impersonation

Hard to remain neutral on this one

Foxconn, Amazon, Apple join Toshiba chip plant feeding frenzy

Meanwhile, Tosh shoves WDC's stake back, mutters 'keep it'

Apple vs. Samsung to climb back into rounded rectangle of justice

Retrial over amount of patent-pinch damages okayed by Californian judge

Samsung needs to eat itself, not copy Apple's X-rated margins

Analysis Short-term greed risks long-term irrelevance

Apple and SK Hynix agree Toshiba terms: Bain to grab chip arm

+Comment Looks like WDC is scuppered apart from legal blocks

Toshiba: Dear Western Digital. Let's talk flash fab moolah

Sell our interest we must, but current flash still needs cash...

Toshiba said yes to the Bain-Capital-backed bunch – reports

The question is... will Western Dig give the OK?

If you're bored of the WDC-Toshiba flash fab saga, reports suggest it may be over soon

+Comment Tight lips at both firms but whispers suggest a brewing bromance