Chip-fryer hits 48 layers

SK Hynix is set to produce 48-layer 3D NAND.

It has been reported that SK Hynix is completing a 3N NAND fab to produce 48-layer NAND chips. Stacking 2D or planar NAND in vertical layers increases the flash chip’s capacity without increasing its footprint. All NAND foundry operators are moving to 3D NAND as shrinking 2D NAND cell sizes lower than 12-15nm has hit a brick wall in terms of signal detection reliability and NAND endurance. Currently Samsung is shipping 48-layer NAND and has a 15.36TB 64-layer product. SK Hynix says its 48-layer chip will account for more than half of its NAND chip volume. ®