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More Toshiba, WD 3D flash

Toshiba and WDC will invest $14.6bn (1.5tn yen) over three years to boost their 3D NAND production.

A new 3D NAND chip fab (Fab 6?) will be added to Tosh’s Yokkaichi complex in the Mie Prefecture, Japan, with site preparation taking place this year and construction starting in 2017. Yokkaichi Fab 2 is having a new clean room added to it which should be complete this year.

By buying SanDisk, WDC inherited the flash foundry partnership that company had with Toshiba. 48-layer BiCS 2nd generation 3D NAND chips with 256Gbit capacity are being produced by Toshiba currently. It is expected that a coming BiCS 3 will feature 64 layers, hence increasing capacity. BiCS 3 samples will be ready later this year. ®

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