Articles about Tsv

Intel, Sun vet births fast, inexpensive 3D chip-stacking breakthrough

A startup headed up by former Intel chip architect, Sun Sparc CTO, and Transmeta cofounder David Ditzel has developed a way to allow communication in 3D stacked chips without the expense and fabrication hassles of creating physical connections between the layers. ThruChip Communications' ThruChip Interface (TCI) uses inductive …
Rik Myslewski, 21 Feb 2014
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Samsung offers eco-econo green DRAM

Using through-silicon vias, Samsung is stacking its memory chips higher and reducing energy consumption. It has a 32GB double data rate-3 (DDR3) RDIMM (Registered Dual-Inline Memory Module) using these through-silicon vias (TSVs) to build this 3D chip. The process technology is 30nm and the RDIMM is built from 4Gbit DDR3 …
Chris Mellor, 18 Aug 2011
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Samsung readies less sockety servers for 3D stacked memory

Samsung has worked out a way to stack memory chips vertically, increasing memory density and decreasing power needs. It says next-generation servers are going to have fewer memory sockets – 30 per cent fewer – implying that unless you can stick more memory in a socket, you're going to have less of the stuff. What it's done is …
Chris Mellor, 7 Dec 2010

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