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Samsung readies less sockety servers for 3D stacked memory

Samsung has worked out a way to stack memory chips vertically, increasing memory density and decreasing power needs. It says next-generation servers are going to have fewer memory sockets – 30 per cent fewer – implying that unless you can stick more memory in a socket, you're going to have less of the stuff. What it's done is …
Chris Mellor, 7 Dec 2010
globalisation

Micron preps fat DDR3 server memory

Memory maker Micron Technology says that it has cooked up the first DDR3 main memory modules for servers to make use of a new technology, called load-reduced dual-inline memory module (LRDIMM) packaging. The new packaging will not only allow server makers to put fatter memory sticks into their boxes, but more of them than they …

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