Trade organisation Semiconductor Equipment and Materials International (SEMI) said it will survey the tae up of copper interconnect technology at Semicon West, held in San Francisco this week. According to SEMI, the purpose is to identify the factors that limit or have impact on the industry's ability to deliver the benefits of copper interconnect technology. The survey, the results of which will be presented in October, will look at .18, .13 and .10 micron so-called "technology nodes" for logic and memory devices. Philips Analytical will aid SEMI in its research, which will canvass opinions from manufacturers as well as industry figures and designers. ®