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VIA to get 0.13 micron Cyrix III out ahead of Intel Tualatin
TSMC wins fab contract
The Taiwan Semiconductor Manufacturing Company will fab the next-but-one version of VIA's Cyrix III processor, codenamed the C5C and dubbed Ezra.
TSMC will produce the part at 0.13 micron, which is a revision of VIA's Samuel II CPU, marketed as the Cyrix III. The smaller size of the chip will allow it to achieve speeds of 1GHz and up, VIA reckons.
Ezra is expected early Q3, the same time frame as Intel's first 0.13 micron part, the modified Pentium III codenamed Tualatin. VIA is boasting that it will get its chip to market first.
As reported here last December, TSMC and Via announced their ability to produce processor wafers on .13 micron dies. TSMC has had .13 micron technology and libraries for some time. ®
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Biting the hand that feeds IT
