Fujitsu takes next-gen HPC chip on the road

Exascale powerhouse on the way

Security for virtualized datacentres

Fujitsu is getting ready to tout its next supercomputer silicon at the upcoming Hot Chips conference, a follow-up to the first peek given in June.

The silicon the outfit plans for next-generation big iron, the SPARC64 Xlfx, is Fujitsu's hope for exascale computing: a 32-core, 1 Tflop (double precision) / 2 Tflop (single precision) monster designed to work with the Tofu2 optical interconnect.

In this presentation from the end of June, the vendor says the Xlfx will be the base of a 3-CPU memory board, with 12 CPU nodes per 2-unit water cooled chassis and 200 nodes per cabinet. Inter-chassis connections will be provided by Finisar optical modules, and each chassis will include multiple Micron hybrid memory cubes (HMCs).

In another presentation, Fujitsu says the Xlfx-based system will deliver 100 Petaflops per cabinet, and will have 12.5 gigabytes/second bidirectional communication links (which more than doubles the 5 GB/s speed of the Tofu1 interconnect used in the company's K computer).

All up, the company says, the Xlfx system packs one K computer cabinet's worth of iron grunt into each chassis, while being binary-compatible with the K and its immediate predecessor, the PRIMEHPC FX10.

The software stack has automatic parallelisation compilers for Fortran, C and C++, and supports OpenMP, MPI, and XPFortran.

Hot Chips kicks off on Sunday, August 10. ®

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