Feeds

Semiconductor boffin: 3D NAND don't need NO STEENKIN' TSVs

Cut out 'n' keeper for your storage primer

Beginner's guide to SSL certificates

Blocks and Files Chip analyst Jim Handy of Objective Analysis took exception to several issues raised in a recent 3D NAND story, and El Reg storage desk asked him a few short questions for clarification.

He provided a few short answers that did just that - and here they are.

El Reg: Are there TSVs (through-silicon vias – vertical electrical connections through a stack of chips) in 3D NAND? And if not, why not?

Jim Handy: There are no TSVs in 3D NAND because there is no need for TSVs. You use TSVs to connect multiple chips, and 3D NAND is single chips.

El Reg: Does 3D NAND use stacks of planar cells?

Jim Handy: 3D NAND uses cells built sideways. These are very different from planar cells. What if you stop calling it "3D" and start calling it "Sideways" NAND (at least to yourself)? That might set your thinking in the right direction.

El Reg: How do the flash cell geometries in planar NAND and 3D NAND compare? How does 3D NAND affect lithographies?

Jim Handy: 3D NAND cells have doughnut-shaped cells and planar cells are flat and square. It's hard to compare the cell "sizes" since they are different things altogether. The process for 3D is not litho-intensive so manufacturers will be using relaxed process technologies like 40-50nm while working to use an aggressive number of layers.

Jim Handy: Samsung has made claims of higher reliability but hasn't released specifications to back that up. One very good reporter I know (you) published an article last August named something like: “Samsung’s cooking 3D NAND flash chips. What Did You Say the Specs Were? Oh right… you didn’t! I have guessed that the use of a charge trap will lower programming energy which should increase endurance, so that's a double benefit: Lower write power and longer life. I'm not positive about that, though."

The analyst seems very keen to get his hands on some, though. "I find it interesting that Samsung's now producing its 2G 3D V-NAND when I have been unable to find anyone outside of the company that has encountered its 1G 3D V-NAND."

Thank you kindly Jim. TSVs are an inter-chip connect and a single chip doesn’t need them. Engrave it on your brain, tattoo it somewhere, or write it on your screen saver. ®

Intelligent flash storage arrays

More from The Register

next story
NSA SOURCE CODE LEAK: Information slurp tools to appear online
Now you can run your own intelligence agency
Azure TITSUP caused by INFINITE LOOP
Fat fingered geo-block kept Aussies in the dark
NASA launches new climate model at SC14
75 days of supercomputing later ...
Yahoo! blames! MONSTER! email! OUTAGE! on! CUT! CABLE! bungle!
Weekend woe for BT as telco struggles to restore service
Cloud unicorns are extinct so DiData cloud mess was YOUR fault
Applications need to be built to handle TITSUP incidents
BOFH: WHERE did this 'fax-enabled' printer UPGRADE come from?
Don't worry about that cable, it's part of the config
Stop the IoT revolution! We need to figure out packet sizes first
Researchers test 802.15.4 and find we know nuh-think! about large scale sensor network ops
SanDisk vows: We'll have a 16TB SSD WHOPPER by 2016
Flash WORM has a serious use for archived photos and videos
Astro-boffins start opening universe simulation data
Got a supercomputer? Want to simulate a universe? Here you go
prev story

Whitepapers

Seattle children’s accelerates Citrix login times by 500% with cross-tier insight
Seattle Children’s is a leading research hospital with a large and growing Citrix XenDesktop deployment. See how they used ExtraHop to accelerate launch times.
Why CIOs should rethink endpoint data protection in the age of mobility
Assessing trends in data protection, specifically with respect to mobile devices, BYOD, and remote employees.
A strategic approach to identity relationship management
ForgeRock commissioned Forrester to evaluate companies’ IAM practices and requirements when it comes to customer-facing scenarios versus employee-facing ones.
High Performance for All
While HPC is not new, it has traditionally been seen as a specialist area – is it now geared up to meet more mainstream requirements?
Protecting against web application threats using SSL
SSL encryption can protect server‐to‐server communications, client devices, cloud resources, and other endpoints in order to help prevent the risk of data loss and losing customer trust.