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AMD to sound Congo bongo for skinny laptops this month

CULV-rival out shortly

Internet Security Threat Report 2014

AMD's 'Congo' - the chip maker's answer to Intel's ungainly named Consumer Ultra-Low Voltage (CULV) platform - wil be out at the end of the month. Or maybe early next.

So say notebook manufacturer moles quoted by the ever ear-wigging DigiTimes. They add that the thin'n'light laptop platform will comprise AMD's Turion Neo X2 L625, and Athlon Neo X2 L325 and 335 processors.

The 'X2' indicates they're all dual-core parts, which should put Congo ahead of CULV, which predominantly features single-core chippage, though also includes the dual-core Core 2 Duo SU7300. Congo, in contrast, includes just one single-core part in its line up, the Athlon Neo MV-40.

Intel will push CULV as a primarily dual-core platform later in Q4.

All Congo CPUs connect to AMD's M780G integrated chipset.

Congo was due to launch in the summer, but with notebook demand down, AMD appears to have decided discretion was the better part of valour in this case. Even Intel has on just begun to really promote thin'n'light laptops, so AMD was probably wise to wait. ®

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