Feeds

IBM and chums offer wafer-thin 32nm detail

'Prototyping shuttle' to land in Q3 2008?

Beginner's guide to SSL certificates

A semiconductor coalition led by IBM said yesterday that OEM customers can now start designing future products around the group’s jointly developed 32 nanometer (nm) microprocessor production technology, but it remained vague on the finer technology details.

IBM eagerly claimed that the alliance’s latest chip pumping technology can now outstrip the rest of the industry in performance and power consumption because of the level of mastery it reckons it has perfected around 32nm chips that rely on high-k metal gate technology.

A bunch of boffins from the likes of Chartered, Infineon, Samsung, Sony, Toshiba, Freescale, STMicroelectronics that make up the group tested 32nm technology circuits at IBM’s East Fishkill, New York fab lab.

They claimed that performance was 35 per cent better than 45nm tech circuits at the same operating voltage. They also reckoned that the 32nm chip swallowed up 30 to 50 per cent less power than its predecessor.

But they failed to mention when customers might expect to see the next generation chip shipped in volume from the IBM-led group.

Instead Big Blue offered up this fuzzy, slightly misleading statement:

“Silicon support for low-power 32nm HKMG technology will be available through a prototyping shuttle program starting in the third quarter of 2008, with plans for quarterly shuttles.”

AMD, which last week said it planned to lay off ten per cent of its workforce over the next two fiscal quarters as it continues to play catch-up with Chipzilla, was notably absent from the alliance’s latest press release. This absence seems to suggest that it didn’t have any direct involvement in the most recent bit of IBM-led shrink-it-and-see research.

Market leader Intel, which has already moved to 45nm with high-k metal gate, offered up a roadmap late last night saying it hoped to dish up its own itsy bitsy 32nm-flavoured chip in 2009, with plans to make it widely available in 2010. Intel also demoed 32nm parts last year.

The IBM-alliance between semiconductor vendors was formed in May last year and was spurred on by the group’s eagerness to offset rising fabrication costs and keep up with Intel. ®

Security for virtualized datacentres

More from The Register

next story
It's Big, it's Blue... it's simply FABLESS! IBM's chip-free future
Or why the reversal of globalisation ain't gonna 'appen
'Hmm, why CAN'T I run a water pipe through that rack of media servers?'
Leaving Las Vegas for Armenia kludging and Dubai dune bashing
Facebook slurps 'paste sites' for STOLEN passwords, sprinkles on hash and salt
Zuck's ad empire DOESN'T see details in plain text. Phew!
CAGE MATCH: Microsoft, Dell open co-located bit barns in Oz
Whole new species of XaaS spawning in the antipodes
Microsoft and Dell’s cloud in a box: Instant Azure for the data centre
A less painful way to run Microsoft’s private cloud
AWS pulls desktop-as-a-service from the PC
Support for PCoIP protocol means zero clients can run cloudy desktops
prev story

Whitepapers

Choosing cloud Backup services
Demystify how you can address your data protection needs in your small- to medium-sized business and select the best online backup service to meet your needs.
Forging a new future with identity relationship management
Learn about ForgeRock's next generation IRM platform and how it is designed to empower CEOS's and enterprises to engage with consumers.
Security for virtualized datacentres
Legacy security solutions are inefficient due to the architectural differences between physical and virtual environments.
Reg Reader Research: SaaS based Email and Office Productivity Tools
Read this Reg reader report which provides advice and guidance for SMBs towards the use of SaaS based email and Office productivity tools.
Storage capacity and performance optimization at Mizuno USA
Mizuno USA turn to Tegile storage technology to solve both their SAN and backup issues.