Feeds

Tosh talks up Flash chip stack tech

Through-silicon vias to boost storage capacities

SANS - Survey on application security programs

Toshiba has applied the through-silicon via (TSV) technique - chip makers' flavour-of-the-month technology - to boost the capacity of NAND Flash chips with only a "minimal" increase in chip size and no need for a new fabrication node.

Announced today at the VLSI Symposium, held in Kyoto, Japan, Toshiba's new Flash structure places multiple layers of electrode material and insulating films one on top of the other, drills many parallel holes down through the stack then fills the holes with electrode pillars. Where each pillar crosses each the electrode layer you get a memory cell. Increasing the number of pillars and the number of layers boosts the storage capacity of the structure.

Toshiba's stacked Flash tech
Toshiba's Flash stack tech: the basics

Toshiba claimed its approach is easier to manufacture than a structure built by stacking traditional 2D Flash arrays. Chip size doesn't increase as much as it would with this latter approach because pillars that link through to peripheral circuitry can be shared.

Toshiba's new method has a Sonos structure - silicon-oxide-nitride-oxide-silicon. The electrical charge is held in the silicon-nitride film, which is formed inside gate holes. Traps are formed to lock the electrical charge inside the silicon-nitride film, Toshiba said.

Toshiba's stacked Flash tech
Toshiba's Flash stack tech: in detail

Toshiba's announcement comes two months after IBM, Intel and Samsung all separately said they would be using TSVs to increase the density of a variety of chip types, from SDRAM memory to microprocessors.

Combat fraud and increase customer satisfaction

More from The Register

next story
Reg man builds smart home rig, gains SUPREME CONTROL of DOMAIN – Pics
LightwaveRF and Arduino: Bright ideas for dim DIYers
Leaked pics show EMBIGGENED iPhone 6 screen
Fat-fingered fanbois rejoice over Chinternet snaps
Apple patent LOCKS drivers out of their OWN PHONES
I'm sorry Dave, I'm afraid I can't let you text that
Microsoft signs Motorola to Android patent pact – no, not THAT Motorola
The part that Google never got will play ball with Redmond
Slip your finger in this ring and unlock your backdoor, phone, etc
Take a look at this new NFC jewellery – why, what were you thinking of?
Happy 25th birthday, Game Boy!
Monochrome handset ushered in modern mobile gaming era
Rounded corners? Pah! Amazon's '3D phone has eye-tracking tech'
Now THAT'S what we call a proper new feature
US mobile firms cave on kill switch, agree to install anti-theft code
Slow and kludgy rollout will protect corporate profits
prev story

Whitepapers

Securing web applications made simple and scalable
In this whitepaper learn how automated security testing can provide a simple and scalable way to protect your web applications.
3 Big data security analytics techniques
Applying these Big Data security analytics techniques can help you make your business safer by detecting attacks early, before significant damage is done.
The benefits of software based PBX
Why you should break free from your proprietary PBX and how to leverage your existing server hardware.
Mainstay ROI - Does application security pay?
In this whitepaper learn how you and your enterprise might benefit from better software security.
Combat fraud and increase customer satisfaction
Based on their experience using HP ArcSight Enterprise Security Manager for IT security operations, Finansbank moved to HP ArcSight ESM for fraud management.