Feeds

Tosh talks up Flash chip stack tech

Through-silicon vias to boost storage capacities

Remote control for virtualized desktops

Toshiba has applied the through-silicon via (TSV) technique - chip makers' flavour-of-the-month technology - to boost the capacity of NAND Flash chips with only a "minimal" increase in chip size and no need for a new fabrication node.

Announced today at the VLSI Symposium, held in Kyoto, Japan, Toshiba's new Flash structure places multiple layers of electrode material and insulating films one on top of the other, drills many parallel holes down through the stack then fills the holes with electrode pillars. Where each pillar crosses each the electrode layer you get a memory cell. Increasing the number of pillars and the number of layers boosts the storage capacity of the structure.

Toshiba's stacked Flash tech
Toshiba's Flash stack tech: the basics

Toshiba claimed its approach is easier to manufacture than a structure built by stacking traditional 2D Flash arrays. Chip size doesn't increase as much as it would with this latter approach because pillars that link through to peripheral circuitry can be shared.

Toshiba's new method has a Sonos structure - silicon-oxide-nitride-oxide-silicon. The electrical charge is held in the silicon-nitride film, which is formed inside gate holes. Traps are formed to lock the electrical charge inside the silicon-nitride film, Toshiba said.

Toshiba's stacked Flash tech
Toshiba's Flash stack tech: in detail

Toshiba's announcement comes two months after IBM, Intel and Samsung all separately said they would be using TSVs to increase the density of a variety of chip types, from SDRAM memory to microprocessors.

Intelligent flash storage arrays

More from The Register

next story
Heyyy! NICE e-bracelet you've got there ... SHAME if someone were to SUBPOENA it
Court pops open cans of worms and whup-ass in Fitbit case
SLURP! Flick your TONGUE around our LOLLIPOP – Google
Android 5 is coming – IF you're lucky enough to have the right gadget
Official: European members prefer to fondle Apple iPads
Only 7 of 50 parliamentarians plump for Samsung Galaxy S
Fujitsu CTO: We'll be 3D-printing tech execs in 15 years
Fleshy techie disses network neutrality, helmet-less motorcyclists
Space Commanders rebel as Elite:Dangerous kills offline mode
Frontier cops an epic kicking in its own forums ahead of December revival
VINYL is BACK and you can thank Sonos for that
The format that wouldn’t die is officially in remission
prev story

Whitepapers

Choosing cloud Backup services
Demystify how you can address your data protection needs in your small- to medium-sized business and select the best online backup service to meet your needs.
Getting started with customer-focused identity management
Learn why identity is a fundamental requirement to digital growth, and how without it there is no way to identify and engage customers in a meaningful way.
High Performance for All
While HPC is not new, it has traditionally been seen as a specialist area – is it now geared up to meet more mainstream requirements?
Internet Security Threat Report 2014
An overview and analysis of the year in global threat activity: identify, analyze, and provide commentary on emerging trends in the dynamic threat landscape.
Intelligent flash storage arrays
Tegile Intelligent Storage Arrays with IntelliFlash helps IT boost storage utilization and effciency while delivering unmatched storage savings and performance.