Feeds

Tosh talks up Flash chip stack tech

Through-silicon vias to boost storage capacities

Remote control for virtualized desktops

Toshiba has applied the through-silicon via (TSV) technique - chip makers' flavour-of-the-month technology - to boost the capacity of NAND Flash chips with only a "minimal" increase in chip size and no need for a new fabrication node.

Announced today at the VLSI Symposium, held in Kyoto, Japan, Toshiba's new Flash structure places multiple layers of electrode material and insulating films one on top of the other, drills many parallel holes down through the stack then fills the holes with electrode pillars. Where each pillar crosses each the electrode layer you get a memory cell. Increasing the number of pillars and the number of layers boosts the storage capacity of the structure.

Toshiba's stacked Flash tech
Toshiba's Flash stack tech: the basics

Toshiba claimed its approach is easier to manufacture than a structure built by stacking traditional 2D Flash arrays. Chip size doesn't increase as much as it would with this latter approach because pillars that link through to peripheral circuitry can be shared.

Toshiba's new method has a Sonos structure - silicon-oxide-nitride-oxide-silicon. The electrical charge is held in the silicon-nitride film, which is formed inside gate holes. Traps are formed to lock the electrical charge inside the silicon-nitride film, Toshiba said.

Toshiba's stacked Flash tech
Toshiba's Flash stack tech: in detail

Toshiba's announcement comes two months after IBM, Intel and Samsung all separately said they would be using TSVs to increase the density of a variety of chip types, from SDRAM memory to microprocessors.

Intelligent flash storage arrays

More from The Register

next story
Hi-torque tank engines: EXTREME car hacking with The Register
Bentley found in a hedge gets WW2 lump insertion
What's MISSING on Amazon Fire Phone... and why it WON'T set the world alight
You fought hard and you saved and earned. But all of it's going to burn...
Trousers down for six of the best affordable Androids
Stylish Googlephones for not-so-deep pockets
Download alert: Nearly ALL top 100 Android, iOS paid apps hacked
Attack of the Clones? Yeah, but much, much scarier – report
Fujitsu CTO: We'll be 3D-printing tech execs in 15 years
Fleshy techie disses network neutrality, helmet-less motorcyclists
prev story

Whitepapers

Go beyond APM with real-time IT operations analytics
How IT operations teams can harness the wealth of wire data already flowing through their environment for real-time operational intelligence.
10 threats to successful enterprise endpoint backup
10 threats to a successful backup including issues with BYOD, slow backups and ineffective security.
Forging a new future with identity relationship management
Learn about ForgeRock's next generation IRM platform and how it is designed to empower CEOS's and enterprises to engage with consumers.
High Performance for All
While HPC is not new, it has traditionally been seen as a specialist area – is it now geared up to meet more mainstream requirements?
Website security in corporate America
Find out how you rank among other IT managers testing your website's vulnerabilities.