Feeds

Otellini stakes low-power future on strained silicon

Chipset 'shortage' too

IDF Intel's strained silicon process will stand it in good stead through the next four generations of the chip giant's processor products, Intel CEO Paul Otellini claimed today.

He also signalled the end to the current capacity constraints affecting the company's chipset production.

Speaking to reporters after his Intel Developer Forum keynote, Otellini rejected the suggestion that the company's plan to boost processor performance while simultaneously reducing power consumption would force it to embrace silicon-on-insulator, as arch-rival AMD has done.

"We're not going to use SOI," he said. "We can do this without the cost and complexity of adding SOI, not for the next four generations, in particular with what we're doing with strained silicon."

Intel's process roadmap calls for a shift to 65nm in 2006, followed by a move to 45nm in the 2008 timeframe. Otellini re-iterated Intel's expectation that in Q3 2006, 65nm output will overtake 90nm production.

Otellini said there was a "significant" drive to roll out its 65nm process at its 300mm-wafer fabs. He admitted there was currently a "shortage" of some chipsets, built in Intel's 200mm-wafer fabs, but promised that as CPU production moves to 65nm, 90nm 300mm wafer capacity will be freed up for chipsets and "other products".

However, 65nm CPUs are not expected to go into volume production until late Q4, so supply may remain limited for a while yet, forcing Intel to focus on higher-end, higher-margin parts for the time being. ®

Whitepapers

Forging a new future with identity relationship management
Learn about ForgeRock's next generation IRM platform and how it is designed to empower CEOS's and enterprises to engage with consumers.
Storage capacity and performance optimization at Mizuno USA
Mizuno USA turn to Tegile storage technology to solve both their SAN and backup issues.
The next step in data security
With recent increased privacy concerns and computers becoming more powerful, the chance of hackers being able to crack smaller-sized RSA keys increases.
Security for virtualized datacentres
Legacy security solutions are inefficient due to the architectural differences between physical and virtual environments.
A strategic approach to identity relationship management
ForgeRock commissioned Forrester to evaluate companies’ IAM practices and requirements when it comes to customer-facing scenarios versus employee-facing ones.