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VIA gears up for DDR333

Testing, conference

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VIA is paving the way for DDR333-supporting versions of its chipsets with a validation programme, and a one day conference devoted to the latest fast memory technology.

The JEDEC-standard validation programme includes heat testing to see how memory modules perform under stress and is handled by Advanced
Validation Labs (AVL)
, a US testing firm.

VIA is waving the DDR333 flag with a one day "Summit" next month in Taipei. This will feature DDR333 solutions from memory vendors and mobo makers, and contributions from analysts.

The Taiwanese company today also announced the ProSavageDDR PN266T, apparently the first DDR266 mobile chipset for Intel Pentium III-M systems. This delivers a claimed 30 per cent reduction in voltage, good for power-saving and extending battery life. ®

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