Feeds

AMD to announce 300mm wafer fab partner by year's end

Just as soon as Fab 30 gets up to full capacity

  • alert
  • submit to reddit

AMD expects to reveal who it will build its first 300mm wafer fab with - and when - by the end of the year, the head of the company's Computing Product Group, Dirk Meyer, has said.

There's no rush, it seems, since the economics of producing Athlons that are half the die size of the Pentium 4 suit AMD very well.

AMD's Fab 30, in Dresden, is currently punching out all the Athlons and Durons it can, using a 0.18 micron process. Meyer said the plant will achieve maximum output by the end of this year. During the second half of 2002, AMD will begin converting production lines over to 0.13 micron, he said.

AMD is, of course, scheduled to ship 0.13 micron Athlons and Durons before then, in the first half of next year: the Thoroughbred Athlon and a Duron codenamed Appaloosa. In the second half, Thoroughbred will transition to Barton, a 0.13 micron Athlon fabbed using silicon-on-insulator technology. AMD's 64-bit Hammer family will use that process too. ®

Whitepapers

Forging a new future with identity relationship management
Learn about ForgeRock's next generation IRM platform and how it is designed to empower CEOS's and enterprises to engage with consumers.
Storage capacity and performance optimization at Mizuno USA
Mizuno USA turn to Tegile storage technology to solve both their SAN and backup issues.
The next step in data security
With recent increased privacy concerns and computers becoming more powerful, the chance of hackers being able to crack smaller-sized RSA keys increases.
Security for virtualized datacentres
Legacy security solutions are inefficient due to the architectural differences between physical and virtual environments.
A strategic approach to identity relationship management
ForgeRock commissioned Forrester to evaluate companies’ IAM practices and requirements when it comes to customer-facing scenarios versus employee-facing ones.