The next generation of DDR memory took a major step closer to the market yesterday when the semiconductor standards organisation JEDEC released its preliminary spec for the technology.

Now that's done, memory makers can begin developing silicon to that specification. No simple process this: samples are not expected until the middle of next year, while mass production won't begin until Q2 2003 at the earliest.

The so-called DDR II spec describes a 1.8V device running at up to 533MHz. The spec also covers enhanced DDR I modes at 400MHz and 533MHz for 3.3GBps and 4.3GBps throughput and dubbed PC3200 and PC4300, respectively.

JEDEC will now begin work defining the DDR III spec, for delivery in 2004-2005. In the meantime, memory developers will provide feedback and comment on the preliminary DDR II spec, which will then be finalised. ®