TSMC preps rapid 300mm, 0.10 micron roll-outs
How we'll dominate chip production
By 2010 more than half of the world's chip production will be handled through semiconductor foundries as more and more fab-less designers contract out manufacture to designer-less fabs.
That, at least, is what leading foundry TSMC reckons, and it's counting on a rapid roll-out of next-generation chip fabrication technology to make it so. The company reckons half of its output will be produced on 300mm wafers within four years, and it expects to offer a 0.10 micron process in the third quarter of next year.
TSMC has been piloting 300mm wafer production since December, and it's constructing two full 300mm fabs at Hsinchu and Tainan which will go into volume production in Q4 2001 and H1 2002, respectively.
TSMC will get around twice as many chips from a 300mm wafer as it would from the current 200mm (8in) standard, increasing yields and - hopefully - cutting part costs. ®