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Infineon to start churning out 300mm wafers in second half

German giant polishes Dresden fab

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Infineon Technologies has finished building its fab in Dresden, which will churn out memory products using 300mm technology.

Production equipment will now be installed in the plant, which the German company started building last May.

The first products using the 300mm technology are expected to roll off the production lines in the second half of this year. The plant is expected to reach full capacity by the end of next year, when it will produce 6000 wafers per week.

Around 1.1 billion Euros ($990 million) will have been invested in the plant when all the work on it is complete, with the creation of around 1,100 jobs.

"With the help of 300mm production technology, Infineon aims to achieve significant cost savings per chip and considers the volume production of 300mm chips as indispensable for the cost-effective manufacture of semiconductors," said Dr Peter Kucher, VP and MD of Infineon Technologies SC300 - the company started to produce and develop the technology.

Kucher added that, compared with conventional 200mm technology to date, around two-and-a-half as many chips could now be squeezed onto the bigger silicon wafers. ®

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