Feeds

Taiwanese duo do DIMM successor

Window Ball Grid Array faster, smaller, better

  • alert
  • submit to reddit

Taiwanese chip companies Apacer and United Test Center are planning the successor to SIMMs and DIMMs - a memory module based on processor-style packaging.

The pair propose to use a Window Ball Grid Array (WBGA) system to connect memory to a host machine. According to Apacer President Y S Chen, cited by Taiwanese business paper, the Commercial Times, WBGA is better than the strip-like modules PC memory is currently installed on, known in the trade as Thin Small Outline Package (TSOP) devices.

WBGA will allow memory modules to be smaller, lighter, more capacious and less power-hungry than current DIMMs. It also works better at the ever higher clock speeds system memory runs at these days. ®

Whitepapers

Why and how to choose the right cloud vendor
The benefits of cloud-based storage in your processes. Eliminate onsite, disk-based backup and archiving in favor of cloud-based data protection.
A strategic approach to identity relationship management
ForgeRock commissioned Forrester to evaluate companies’ IAM practices and requirements when it comes to customer-facing scenarios versus employee-facing ones.
Go beyond APM with real-time IT operations analytics
How IT operations teams can harness the wealth of wire data already flowing through their environment for real-time operational intelligence.
The total economic impact of Druva inSync
Examining the ROI enterprises may realize by implementing inSync, as they look to improve backup and recovery of endpoint data in a cost-effective manner.
Reg Reader Research: SaaS based Email and Office Productivity Tools
Read this Reg reader report which provides advice and guidance for SMBs towards the use of SaaS based email and Office productivity tools.