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Taiwanese duo do DIMM successor

Window Ball Grid Array faster, smaller, better

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Taiwanese chip companies Apacer and United Test Center are planning the successor to SIMMs and DIMMs - a memory module based on processor-style packaging.

The pair propose to use a Window Ball Grid Array (WBGA) system to connect memory to a host machine. According to Apacer President Y S Chen, cited by Taiwanese business paper, the Commercial Times, WBGA is better than the strip-like modules PC memory is currently installed on, known in the trade as Thin Small Outline Package (TSOP) devices.

WBGA will allow memory modules to be smaller, lighter, more capacious and less power-hungry than current DIMMs. It also works better at the ever higher clock speeds system memory runs at these days. ®

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