Intel says no probs with flip chips cracking
But heat sink specifications critical
Semiconductor firm Intel said today that it has had no reports of packaging cracking on its FC-PGA (flip chip packaging) microprocessors. But, at the same time, it has warned enthusiasts that they need to use the right type of heat sink with the socketed chips to avoid damaging the packaging. That follows reports on an overclocker's page, which we reported in our hardware roundup yesterday, suggesting several instances of Intel FC-PGA chips cracking. A spokesman for Intel said: "It's important to use the right kind of heatsink with FC-PGA packaging". He said that while heat sinks designed for ceramic socketed microprocessors might look like they would work with the plastic packaged chips, the thickness of heat sinks designed for FC-PGA chips was different. He added: "We haven't seen any reports of this packaging breaking." Intel worked with its PC customers to design heat sinks specifically tailored to FC-PGA chips, and these were made to exacting specifications, he said.
Sponsored: Transform Your IT Infrastructure