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Infineon pulls 12-incher out of plants

New fab for Dresden will reduce costs

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Infineon, the former semiconductor wing of Siemens which was spun off earlier this month, said today it will build a 12-inch (300mm) wafer module at its existing plant in Dresden. The firm will plough over €1 billion into the plant over the next three years, and the additional fab facilities will create over 1000 additional jobs at Dresden, in Saxony. The move will allow a jump in productivity as well as cost savings for chip production, the firm said. Motorola and Infineon started work on 300mm wafer technology two years back and started producing 64Mb memories on wafers at a pilot line last September. The Dresden Infineon fab currently employs nearly 3000 people, and the move to a 12-inch wafer model will produce yields of 2.5 more than the existing eight inch technology largely in use at semiconductor facilities around the world. ®

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