UMC, Siemens and IBM to cooperate on copper chips

e-DRAM -- you knew it had to come

The biggest foundry in IT powerhouse Taiwan, has struck a deal with IBM and Siemens spin-off Infineon to make .10 micron logic chips which use copper interconnects and also combine memory, logic and mixed signal circuits in one part. The chips, which will be called e-memories, or e-DRAM, will be developed by boffins and engineers working together at IBM's research and development centre in the States. The technology will then be licensed to all three partners in the concern and lasts until the year 2003. The chips will start off at the .13 micron level but then will be slimmed down to a .10 micron process, with the first samples expected before June, the companies said. The alliance is a continuance of one between Siemens and IBM initiated in 1998, with UMC being brought into the charmed circle because of its foundry muscle and its designer know-how. The parts will be marketed by UMC using the brand name Worldlogic, said the partners. ®

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