IBM could deliver the first of its SOI (Silicon On Insulator) PowerPC chips with copper interconnect to Apple within the next two months, according to US reports. This would give Apple the opportunity to be the first company to ship machines using the new technology, which offers a claimed 30 per cent performance gain over non-SOI chips. SOI increases a chip's switching speed, and like copper is viewed by IBM as one of its major secret weapons. The superior performance of copper interconnect chips has helped keep Apple interested in IBM's flavour of PowerPC, and SOI may help some more. The chips to be offered to Apple will be PowerPC 750 copper/SOI at 0.22 micron, and could be used by the company to add greater beef to its mainstream machines in the advance of the appearance of Motorola's PowerPC G4, which Motorola assuring us is on target for Q3 (G4 not delayed - Motorola) If it's not, IBM may be poised to pounce. It'll be moving to copper/SOI at 0.18 and then 0.13 micron, and is roadmapping a 1GHz 64-bit chip for 2001. ®