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AMD copper techniques emerge

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Chip company AMD has been awarded a patent for a method of fabricating copper and aluminium metallisation. The patent number is 5,913,147, granted today and applied for on 21 Jan 1997. The inventors are Valery Dubin and Chiu Ting. The patent is a method for fabricating copper aluminium metallisation using the technique of electro-less copper deposition. The method provides a self-encapsulated copper aluminium metallisation structure. Got that? ®

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