A poster on one of the myriad investor conferences claims to have heard AMD's CEO, Jerry Sanders III, outlining futures of the K7. According to the post, Sanders said a tier one OEM will ship a K7 box in July. At the same time, AMD's K62 mobile chip will appear in an IBM ThinkPad and in machines from Compaq, Toshiba and NEC. According to the report, the K7 will drag in Dell to support AMD processors, while Dresden will ship .18 micron technology in Q1 of next year using copper technology. ®