Dane-Elec introduces stacking 3D modules

Stack em up for more density

Memory module manufacturer and distributor Dane-Elec said today that it had succeeded in a technique for creatin three dimensional memory modules. The company said that the technique was adapted from component miniaturisation and high density technologies, allowing it to stack memory chips inside a cubic package using BGA surface mount technology. The advantages of the technique is that it gives higher access speeds because of reduced connection length and also gives benefits in electrical, mechanical and thermal performance. Dane-Elec said it will be able to build 1Gb on a single motherboard connector. ®

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