AMD fab plans leak out

Nothing on wafer numbers but it goes ball grid array

A reader sent us some interesting information from a Japanese Web site and thoughtfully translated it for us too. According to this information, AMD will shift the manufacturing process of the K6-III from 0.25 micron to 0.18 micron in the second half of 1999, but has not yet decided whether to perform that miracle on the K6-2, as yet. The physical limit of the K6-III's 0.25 frequency is 550MHz and they already have 550MHz running on this process using a simulator. AMD will ship its mobile K6-III in the first half of this year but do not have a plan to reduce the consumption power, which will be 2.4 volts. Meanwhile, other Asian reports say AMD will produce a ball grid array (BGA) package later this year and will beef up its production facilities at its fab in Thailand. Does this chime with our report yesterday, we wonder (see K7 chipset reported delayed). The site is here. ®

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