TSMC claims rapid ramp in .25 micron process
Taiwanese manufacturer sees broad based support
Magic Quadrant for Enterprise Backup/Recovery
The Taiwan Semiconductor Manufacturing Company (TSMC) has claimed that it has moved to .25 micron process rapidly in response to customer demand. The company said that it now has fifteen products using the technology emerging from its Taiwanese fab, which will ramp to around 15,000 wafers a month. Those products cover CPUs, programmable logic devices, DSP and multimedia products, said the company. According to TSMC, over 100 customers are running .25 micron design libraries from its 14 library partners. TSMC said it will tape out .18 micron technology in Q4 of this year, with production release at the end of the first quarter in 1999. The company also claimed it will produce a low voltage, low power .25 process for mobile applications and a logic based embedded DRAM process for DSP, mobile and networking applications. ®
IT infrastructure monitoring strategies
Agentless Backup is Not a Myth
Top 10 SIEM implementer’s checklist
Steps to Take Before Choosing a Business Continuity Partner
Enabling efficient data center monitoring
